Our CarbonFil filament is based upon the unique PETG blend of our HDglass compound and is reinforced with 20% ultra-light and relatively long stringer carbon fibres, which has resulted in an exceptionally stiff carbon-fibre reinforced 3D printer filament. CarbonFil is twice as stiff as HDglass and yet it is even 10% more impact resistant, which is a remarkable feature for carbon-fibre reinforced filament.
Our first special filament based on the Amphora 3D polymer. Reinforced with 20% specially sourced carbon fibers, this filament is perfect for parts which need high stiffness. XT-CF20 has a beautiful matte surface finish when printed.
CARBON FIBER IS ABRASIVE:
A special point of attention is the abrasive nature of the carbon fibers. In general these fibers will accelerate the nozzle-wear of brass nozzles, much faster than unfilled filaments. Therefore we recommend to use hardened steel nozzles.
The PA-CF Low Warp is a one of a kind polyamide formulation with the ability to print nearly warp free on non heated buildplatforms. Low infill prints come out perfectly flat on cold bed for higher infill prints 40/50C temperature is enough to obtain flat prints.
Carbon 3D Ink® is a blend between M3D’s PLA material and 33% of carbon fiber particles. M3D’s PLA-based Carbon Fiber filament offers unmatched strength and accuracy ideal for making quality and precision parts. Carbon Fiber helps achieve exceptional stiffness and dimensional stability, as well as a highly professional, sleek, and high-tech look for the finished print. This lightweight filament is intended for artistic, non-industrial use. Best for experienced users.
BigRep’s PET-CF is an engineering-grade filament for high-strength additive manufacturing applications. With exceptional dimensional stability and low moisture absorption, it’s the perfect material for printing in industrial environments. Capable of producing exceptionally strong, stiff parts with a fine surface finish and heat resistance up to 100 °C, this material is ideal for functional, performance applications.